Download PDF by Paul M. Brown Jr.: A Guide to Analog Asics

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By Paul M. Brown Jr.

ISBN-10: 0121369706

ISBN-13: 9780121369705

ISBN-10: 032315476X

ISBN-13: 9780323154765

Program particular built-in circuits (ASICs), either analog and electronic, became general process point bulding blocks. ASIC proprietors have tried to supply instruments that they desire will allow quite green IC designers (i.e. platforms engineers) to layout refined customized built-in circuits. This philosophy has been extra winning in electronic expertise than in analog. considerably extra paintings is concerned with analog layout and much fewer automatic instruments can be found. nearly each analog ASIC seller deals diverse semiconductor applied sciences, software units, documentation (usually missing intimately and never delivering the correct heritage and guidelines), and ranging degrees of engineering aid. the result's that many engineers who might use analog ASICs lack the technical info to take action. they aren't convinced whilst customized analog ICs are in your price range or which seller will top serve their wishes. moreover, many engineers don't have enough analog layout event, specifically with built-in circuits. Consqeuently, many that may benefit from analog ASIC know-how don't use it whereas others have undesirable reports that may have simply been kept away from.

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Extra info for A Guide to Analog Asics

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3. The forward voltage drop φ is directly proportional to absolute temperature. s These characteristics can be used to perform an amazing array of precision analog functions. Examples will be presented in Chapter 5. Junction Breakdown A reverse-biased pn junction will exhibit a small current flow due to minority carrier holes and electrons that are accelerated across the de­ pletion region by the electric field (there could also be leakage contrib­ uted by ionic contamination on the surface of the wafer).

Figure 2-17 illustrates how the components fab­ ricated during the process described above might be interconnected. The last step in the wafer fabrication process is passivation. This step coats the wafer with a layer of glass, which serves several func­ tions. First, and most obvious, this coating provides scratch protection for the soft aluminum "wiring" on the chip. It also forms a barrier to moisture and contaminants that the chip may encounter during pack­ aging and during its lifetime. A less obvious function is to getter the wafer surface of ionic contamination that has collected during the en­ tire processing operation.

0-V breakdown voltage is useful. Table 3-3 summarizes typical pinched-resistor characteristics. 3 Bipolar Transistors 47 R -ΛΛΛΛτ- 2 Epi A Epi substrate 0 Substrate Figure 3-8 Pinched resistor equivalent circuit. resistor are illustrated in Figure 3-8. The most positive terminal is nor­ mally connected to the epi island as shown in Figure 3-7. The pinchedresistor equivalent circuit is the same as a base resistor with the addi­ tion of the Zener element due to the emitter diffusion that causes the pinching action.

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A Guide to Analog Asics by Paul M. Brown Jr.

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